Full-reflection display substrate, manufacturing method thereof and full-reflection display device
AssigneeTechnology Group Co., Ltd.
InventorsJiguo Wang, Jian Sun, Jiantao Liu
Life of this patent
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Abstract
The present disclosure provides a full-reflection display substrate, a manufacturing method thereof and a full-reflection display device. The full-reflection display substrate includes: a base substrate, the base substrate including a display region and a non-display region; a signal line arranged in the display region; a bonding pin arranged in the non-display region, coupled to the signal line and bonded to a driving circuitry; a reflection layer arranged in the display region; and an etch stop pattern arranged at a same layer and made of a same material as the reflection layer, arranged in the non-display region, and at least covering a side surface of the bonding pin.
Claims11
A full-reflection display substrate, comprising:
- a base substrate, the base substrate including a display region and a non-display region;
- a signal line arranged in the display region;
- a bonding pin arranged in the non-display region, coupled to the signal line and bonded to a driving circuitry;
- a reflection layer arranged in the display region;
- and
- an etch stop pattern arranged at a same layer and made of a same material as the reflection layer, arranged in the non-display region, and at least covering a side surface of the bonding pin;
- wherein the reflection layer is reused as a pixel electrode.
A method for manufacturing a full-reflection display substrate, comprising:
- providing a base substrate, the base substrate including a display region and a non-display region;
- forming a signal line in the display region and forming a bonding pin in the non-display region, the bonding pin being coupled to the signal line and bonded to a driving circuitry;
- forming a first conductive film layer on the base substrate, the first conductive film layer covering the display region and the non-display region;
- forming a first photoresist pattern and a second photoresist pattern on the first conductive film layer, the first photoresist pattern being arranged in the display region, and the second photoresist pattern being arranged in the non-display region;
- wet-etching the first conductive film layer with the first photoresist pattern and the second photoresist pattern as masks to obtain a reflection layer and an etch stop pattern, the reflection layer being arranged in the display region, and the etch stop pattern being arranged in the non-display region and at least covering a side surface of the bonding pin;
- and removing the first photoresist pattern and the second photoresist pattern;
- wherein the reflection layer is reused as a pixel electrode.
Dependencies are inferred from the claim text.