Board-level pad pattern for multi-row QFN packages
AssigneeMediatek Inc.
InventorsHui-Chi Tang, Shao-Chun Ho, Hsuan-Yi Lin, Pu-Shan Huang
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Abstract
A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch. Multiple square-shaped ball pads are arranged in a third row between the exposed pad region and the staggered ball pads.
Claims16
A board-level pad pattern, comprising:
- a base substrate;
- an exposed pad region disposed within a surface mount region of the base substrate;
- a plurality of staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region, wherein the plurality of staggered ball pads comprises first ball pads arranged in a first row and second ball pads arranged in a second row, wherein the first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch;
- a plurality of square-shaped ball pads arranged in a third row between the exposed pad region and the plurality of staggered ball pads;
- and
- a plurality of signal vias electrically connected to the plurality of square-shaped ball pads, respectively, wherein the plurality of signal vias are arranged in a staggered manner along each side of the exposed pad region, wherein the plurality of signal vias comprise alternately arranged offset signal vias and on-pad signal vias.
Dependencies are inferred from the claim text.