Semiconductor device and semiconductor module
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakayuki Tsutsui, Yuichi Saito
Life of this patent
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Abstract
A semiconductor device includes first member that includes a switch made of a semiconductor element made from an elemental semiconductor. The first member is joined to a second member including a radio-frequency circuit including a semiconductor element made from a compound semiconductor. The switch and the radio-frequency circuit are connected by a path. The path includes an inter-member connection wire made of a metal pattern arranged on an interlayer insulating film extending from a surface of the second member to a surface of the first member or a conductive member allowing a current to flow in a direction crossing an interface where the first member and the second member are joined.
Claims18
A semiconductor device comprising:
- a first member including a switch made of a semiconductor element made from an elemental semiconductor;
- a second member including a radio-frequency circuit including a semiconductor element made from a compound semiconductor, the second member joined to the first member;
- and
- a path connecting the switch and the radio-frequency circuit,
- wherein the path includes an inter-member connection wire made of a metal pattern arranged on an interlayer insulating film extending from a surface of the second member to a surface of the first member or a conductive member allowing a current to flow across a surface joining the first member and the second member.
A semiconductor module comprising:
- a semiconductor device including a first member including a switch made of a semiconductor element made from an elemental semiconductor and a second member including a radio-frequency circuit including a semiconductor element made from a compound semiconductor, the second member joined to the first member, the semiconductor device further including a first conductive protrusion connected to the switch and a second conductive protrusion connected to the radio-frequency circuit;
- a module substrate on which the semiconductor device is mounted;
- and
- a path connecting the switch and the radio-frequency circuit, the path including the first conductive protrusion, a wire disposed on the module substrate, and the second conductive protrusion.
Dependencies are inferred from the claim text.