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US 12,308,275 B2Granted
Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
AssigneeBoard of Regents, The University of Texas System
InventorsSidlgata V. Sreenivasan, Paras Ajay, Aseem Sayal, Mark McDermott, Shrawan Singhal, Ovadia Abed, Lawrence Dunn, Vipul Goyal, Michael Cullinan
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Abstract
A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
Claims10
A method for directly bonding elements onto a product substrate, wherein an element comprises layers of transistors, interconnects, and dielectrics, the method comprising:
- selectively picking one or more elements using a vacuum superstrate attached to said one or more elements, wherein said one or more elements are picked from a substrate, wherein said one or more elements are attached to said substrate using an adhesive;
- and
- placing said selectively picked one or more elements onto said product substrate, wherein sub-100 nm alignment during element placement is enabled by in-liquid fine alignment, wherein an inkjet is utilized for dispensing liquid near edges of die being placed.
Dependencies are inferred from the claim text.