Semiconductor device and method of manufacturing semiconductor device
AssigneeMitsubishi Electric Corporation
InventorKatsumi Nakamura
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AssigneeMitsubishi Electric Corporation
InventorKatsumi Nakamura
Estimating the term…
A semiconductor device according to the present disclosure includes: a semiconductor substrate with a first main surface and a second main surface; a drift layer of a first conductivity type formed in the semiconductor substrate; a first impurity diffusion layer of a second conductivity type formed on the drift layer to be closer to the first main surface; and a buffer layer of the first conductivity type formed on the drift layer to be closer to the second main surface and higher in peak impurity concentration than the drift layer. The drift layer has a first trap, a second trap, and a third trap, whose energy level each is lower than energy at a bottom of a conduction band by 0.246 eV, 0.349 eV, and 0.470 eV. The second trap has trap density of equal to or greater than 2.0×1011 cm−3.
A semiconductor device comprising:
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