Copper alloy wire, plated wire, electric wire and cable using these

A plated wire, comprising:

• a copper alloy wire comprising a copper alloy consisting essentially of a Cu—In alloy containing indium of 0.3 mass % or more and 0.65 mass % or less, and the balance Cu and unavoidable impurities, or a Cu—In—Sn alloy containing indium of 0.3 mass % or more and 0.65 mass % or less, tin of 0.02 mass % or more and less than 0.1 mass %, a total content rate of indium and tin being 0.65 mass % or less, and the balance Cu and unavoidable impurities;
• and
• a plating layer formed on an outer periphery of the copper alloy wire,
• wherein the unavoidable impurities included in the Cu—In alloy or the Cu—In—Sn alloy are 20 mass ppm or more and 30 mass ppm or less, and
• wherein the plated wire comprises the copper alloy wire provided with the plating layer comprises 0.2% proof stress of 300 MPa or more and 350 MPa or less, electrical conductivity of 80% IACS or more and 90% IACS or less, and elongation of 7% or more and 18% or less,
• wherein an outer diameter of the copper alloy wire is 100 μm or less, and a thickness of the plating layer is 0.1 μm or more and 1.5 μm or less,
• wherein the copper alloy wire is obtained by performing a first heat treatment as defined during multiple wire drawing processes and a second heat treatment on a drawn wire obtained in a final wire drawing process after the first heat treatment,
• wherein the first heat treatment is performed so that a ratio C of the 0.2% proof stress values becomes 0.5 or more and 0.8 or less, when 0.2% proof stress of the copper alloy wire before heat treatment is A, and 0.2% proof stress of the copper alloy wire after heat treatment is B, the ratio C of the 0.2% proof stress values is calculated by an equation C=B/A,
• wherein the second heat treatment is performed at heat temperature of 520° C. or more and 580° C. or less for heating time of 0.3 seconds or more and 0.8 seconds or less, and
• wherein a bending life is 3000 times or more.

An electric wire, comprising:

• a conductor;
• and
• an insulation coating an outer periphery of the conductor;
• wherein the conductor comprising a plated wire comprises a copper alloy wire comprising a copper alloy consisting essentially of a Cu—In alloy containing indium of 0.3 mass % or more and 0.65 mass % or less, and the balance Cu and unavoidable impurities, or a Cu—In—Sn alloy containing indium of 0.3 mass % or more and 0.65 mass % or less, tin of 0.02 mass % or more and less than 0.1 mass %, a total content rate of indium and tin being 0.65 mass % or less, and the balance Cu and unavoidable impurities,
• wherein the unavoidable impurities included in the Cu—In alloy or the Cu—In—Sn alloy are 20 mass ppm or more and 30 mass ppm or less, and
• wherein the copper alloy wire provided with a plated layer comprises 0.2% proof stress of 300 MPa or more and 350 MPa or less, electrical conductivity of 80% IACS or more and 90% IACS or less, and elongation of 7% or more and 18% or less,
• wherein an outer diameter of the copper alloy wire is 100 μm or less, and a thickness of the plating layer is 0.1 μm or more and 1.5 μm or less,
• wherein the copper alloy wire is obtained by performing a first heat treatment as defined during multiple wire drawing processes and a second heat treatment on a drawn wire obtained in a final wire drawing process after the first heat treatment,
• wherein the first heat treatment is performed so that a ratio C of the 0.2% proof stress values becomes 0.5 or more and 0.8 or less, when 0.2% proof stress of the copper alloy wire before heat treatment is A, and 0.2% proof stress of the copper alloy wire after heat treatment is B, the ratio C of the 0.2% proof stress values is calculated by an equation C=B/A,
• wherein the second heat treatment is performed at heat temperature of 520° C. or more and 580° C. or less for heating time of 0.3 seconds or more and 0.8 seconds or less, and
• wherein a bending life is 3000 times or more.