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US 12,305,385 B2Granted
Process for encapsulating fragile insulation materials within polyisocyanurate
AssigneeHolcim Technology Ltd
InventorsJohn B Letts, Michael J. Hubbard
Life of this patent
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Abstract
Embodiments of the present invention are based, at least in part, on the discovery of methods for encapsulating fragile insulation materials within polyisocyanurate foam to thereby provide a construction board having an advantageous balance of insulating properties and mechanical durability.
Claims8
A composite insulation board comprising:
- (i) a preformed high-density polyisocyanurate construction board having a first planar surface and a second planar surface, wherein the high-density polyisocyanurate construction board has a density of greater than 2.5 pounds per cubic foot, wherein the preformed high-density polyisocyanurate construction board has a first facer disposed on a first planar surface and a second facer disposed on a second planar surface;
- (ii) a plurality of insulation devices, wherein the insulation devices are vacuum insulation panels, and wherein the plurality of insulation devices are positioned directly on the first facer above the first planar surface of the preformed high-density polyisocyanurate construction board;
- and
- (iii) a polyisocyanurate insulating foam material encapsulating the plurality of insulation devices between the insulating foam and the preformed high-density polyisocyanurate construction board, wherein the insulating foam material has a density of less than 2.5 pounds per cubic foot.
1 more element
Dependencies are inferred from the claim text.