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US 12,302,738 B2Granted
Bonding device and method of manufacturing display device using the same
AssigneeSamsung Display Co., Ltd.
InventorsKisang Yoo, Kyungrok Ko, Youngsu Kim, Jaesuk Yoo, Jeong-Seop Choi
Life of this patent
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Abstract
A bonding device includes: a support in which a plurality of through-holes is defined, a diaphragm disposed on the support to cover the support, a pressing pad disposed on the diaphragm over a top surface of the support, and a window fixing chuck disposed on the pressing pad and in which a groove facing the pressing pad is defined. Here, the pressing pad includes a pad and at least one support bar disposed in the pad and extending in a first direction.
Claims15
A method of manufacturing a display device, the method comprising:
- preparing a diaphragm disposed on a support to cover the support and a pressing pad disposed on the diaphragm over a top surface of the support;
- arranging a display panel on side surfaces of the diaphragm and the pressing pad, wherein the side surfaces of the diaphragm are adjacent to side surfaces of the support;
- arranging a window in a groove of a window fixing chuck disposed above the pressing pad;
- arranging the diaphragm and the pressing pad in the groove;
- bonding a first bent portion of the display panel to a second bent portion of the window, which is adjacent to the first bent portion, by moving the window fixing chuck in a direction toward the pressing pad to press the pressing pad, wherein the first bent portion is disposed on the pressing pad;
- and
- bonding first flat portions of the display panel to second flat portions of the window by expanding the diaphragm, wherein each of the first flat portions extends from the first bent portion in a direction the window fixing chuck moves and is adjacent to the side surface of the diaphragm, and the second flat portions are adjacent to the first flat portions.
4 more elements
Dependencies are inferred from the claim text.