System and device with laser array illumination

A diode laser array module, comprising:

• a first plurality of diode laser modules, wherein:
• each diode laser module of the first plurality of diode laser modules has a respective module body having a top surface, a bottom surface, a first side surface, and a second side surface,
• the respective module body of said each diode laser module includes a respective plurality of first holes in the top surface of the respective module body, and
• said each diode laser module includes a respective plurality of diode lasers mounted at least partially within the respective plurality of first holes of the respective module body of said each diode laser module, with respective pins of the respective plurality of diode lasers extending downward out of the respective plurality of first holes;
• a first plurality of pin connector modules, wherein each respective pin connector module is configured to connect the respective pins of the respective plurality of diode lasers of at least one of the first plurality of diode laser modules to a driving circuit module that is disposed at a location separate from the bottom surface of the module body of said at least one diode laser module;
• and
• a cooling module, wherein the cooling module includes a heat conducting body defined by a top surface, a bottom surface, and at least a first side surface and a second side surface of the cooling module, and includes a cooling structure that is at least partially embedded in the heat conducting body of the cooling module, wherein:
• the top surface of the heat conducting body of the cooling module is in thermal contact with the bottom surfaces of the plurality of diode laser modules, and
• at least one of the bottom surface of the module body of the respective diode laser module or the top surface of the heat conducting body of the cooling module includes one or more recessed areas at locations corresponding to the respective plurality of first holes of the respective module body of the respective diode laser module, such that one or more channels are formed by the one or more recessed areas when the top surface of the heat conducting body of the cooling module is in thermal contact with the bottom surfaces of the respective module bodies of the plurality of diode laser modules,
• each pin connector module includes a respective first conductive portion that is located within the one or more channels formed between the top surface of the body of the cooling module and the bottom surfaces of the respective plurality of diode laser modules and electrically connects the respective plurality of diode lasers that are inserted into the respective plurality of first holes of a respective diode laser module, and
• each pin connector module includes a respective second conductive portion that extends out of the channel formed between the top surface of the body of the cooling module and the bottom surfaces of the plurality of diode laser modules to a location where electrical connections to the driving circuit module are to be made.

A cooled radiator, comprising:

• a heat conducting body defined by a top surface, a bottom surface, and at least a first side surface and a second side surface of the cooled radiator;
• and
• a cooling structure that is at least partially embedded in the heat conducting body of the cooled radiator, wherein:
• the heat conducting body of the cooled radiator includes an array of first holes with corresponding first openings in the top surface of the cooled radiator to accommodate a first plurality of diode lasers,
• the heat conducting body of the cooled radiator includes a plurality of first grooves, wherein each first groove is open in the bottom surface of the cooled radiator and connects a respective row of first holes in the array of first holes, and
• the cooled radiator is configured to be fitted with a plurality of pin connector modules, a respective first groove of the heat conducting body of the cooled radiator is configured to accommodate a respective first conductive portion of each pin connector module that electrically connects a respective row of diode lasers that are inserted into the respective row of the first holes connected by the respective first groove, each pin connector module has at least one respective second conductive portion that is disposed within a portion of the heat conducting body of the cooled radiator that is beyond the respective first groove, the respective second conductive portion of said each pin connector module forms an electrical contact with the respective first conductive portion of said each pin connector module within the heat conducting body of the cooled radiator and is configured to form an electrical contact to a driving circuit module outside of the first side surface of the cooled radiator.