Compact power converter with transistors thermally and electrically connected to a fluid cooled bus bar

An apparatus comprising:

• a 1st bus bar comprising a channel through which non-dielectric fluid flows through the 1st bus bar;
• a 1st metal heat sink comprising a channel through which non-dielectric fluid flows through the 1st metal heat sink;
• a first switch device comprising:
• a 1st metal substrate;
• a 1st metal conductor;
• a 1st transistor comprising 1st and 2nd terminals between which electrical current can flow;
• wherein the 1st transistor is positioned between the 1st metal substrate and the 1st metal conductor;
• wherein the 1st and 2nd terminals are sintered to the 1st metal substrate and the 1st metal conductor, respectively;
• wherein the 1st metal substrate is electrically connected to the 1st bus bar;
• wherein the 1st metal conductor is electrically connected to the 1st metal heat sink
• a 2nd bus bar comprising a channel through which non-dielectric fluid flows through the 2nd bus bar;
• a second switch device comprising:
• a 2nd metal substrate;
• a 2nd metal conductor;
• a 2nd transistor comprising 3rd and 4th terminals between which electrical current is transmitted when the 2nd transistor is activated;
• wherein the 2nd transistor is positioned between the 2nd metal substrate and the 2nd metal conductor;
• wherein the 3rd and 4th terminals are sintered to the 2nd metal substrate and the 2nd metal conductor, respectively;
• wherein the 2nd metal substrate is electrically connected to the 1st metal heat sink;
• wherein the 2nd metal conductor is electrically connected to the 2nd bus bar;
• a 2nd metal heat sink comprising a channel through which non-dielectric fluid flows through the 2nd metal heat sink;
• a third switch device comprising:
• a 3rd metal substrate;
• a 3rd metal conductor;
• a 3rd transistor comprising 5th and 6th terminals between which electrical current is transmitted when the 3rd transistor is activated;
• a fourth switch device comprising:
• a 4th metal substrate;
• a 4th metal conductor;
• a 4th transistor comprising 8th and 9th terminals between which electrical current is transmitted when the 4th transistor is activated;
• wherein the 3rd transistor is positioned between the 3rd metal substrate and the 3rd metal conductor;
• wherein the 5th and 6th terminals are sintered to the 3rd metal substrate and the 3rd metal conductor, respectively;
• wherein the 3rd metal substrate is electrically connected to the 1st bus bar;
• wherein the 3rd metal conductor is electrically connected to the 2nd metal heat sink;
• wherein the 4th transistor is positioned between the 4th metal substrate and the 4th metal substrate;
• wherein the 8th and 9th terminals are sintered to the 4th metal substrate and the 4th metal conductor, respectively;
• wherein the 4th metal substrate is electrically connected to the 2nd metal heat sink;
• wherein the 4th metal conductor is electrically connected to the 2nd bus bar;
• wherein the 1st and 2nd metal heat sinks are thermally connected to each other and electrically isolated from each other.