Substrate treating apparatus and substrate treating method

An apparatus for treating a substrate by using a supercritical fluid, the apparatus comprising:

• a process chamber configured to provide a treatment space, and including a chamber heater configured to increase a temperature of an interior of the treatment space;
• a substrate support provided in the treatment space and configured to support the substrate;
• and
• a substrate heating member configured to heat a lower surface of the substrate while contacting the lower surface of the substrate,
• wherein the process chamber is formed through combination of an upper chamber and a lower chamber coupled to the upper chamber according to upward/downward movement relative to the upper chamber and forming a sealed space through coupling with the upper chamber, and
• wherein the substrate support is coupled to the upper chamber, and the substrate heating member is coupled to the lower chamber, and
• wherein in a closed state wherein the upper chamber is coupled to the lower chamber, the substrate heating member is configured to interrupt the supercritical fluid from being directly ejected to the lower surface of the substrate.