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US 12,297,377 B2Granted
Conductive adhesive composition, and method for producing connection structure
OwnerShinichirou Sukatainventor
Life of this patent
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Abstract
A conductive adhesive composition, the composition containing: (A) conductive particles; (B) a thermosetting resin; and (C) a flux activator. The conductive particles contain a metal having a melting point of 200° C. or lower. In a volume-based cumulative particle size distribution of the conductive particles, a cumulative 50% particle diameter D50 is 3 to 10 μm, and a cumulative 10% particle diameter D10 is 2.4 μm or more. The flux activator contains a compound having a hydroxyl group and a carboxyl group.
Claims10
A conductive adhesive composition, comprising:
- conductive particles;
- a thermosetting resin;
- and
- a flux activator,
- wherein the conductive particles comprise a metal having a melting point of 200° C. or lower,
- a cumulative 50% particle diameter is 3 to 10 μm, and a cumulative 10% particle diameter is 2.4 μm or more, in a volume-based cumulative particle size distribution of the conductive particles,
- the flux activator comprises a compound having a hydroxyl group and a carboxyl group, and
- a content of the conductive particles is 30 to 90% by mass with respect to a total mass of the conductive adhesive composition.
5 more elements
Dependencies are inferred from the claim text.