Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device
AssigneeMitsubishi Chemical Corporation
InventorsTomohiro Kyotani, Eiji Dejima, Naoko Sumitani, Tomohiro Kato, Takeshi Sawai
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Abstract
An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability. The present invention relates to a silica particle in which a proportion of silanol groups present on a surface represented by (x/y)×100% is 15% or less, where a content of silanol groups on the surface is x mass % and a content of bulk silanol groups is y mass %.
Claims18
A silica particle in which a proportion of silanol groups present on a surface represented by (x/y)×100% is 15% or less, where a content of the silanol groups on the surface measured by a Sears method is x mass %, and a content of bulk silanol groups measured by a solid 29Si-DD/MAS-NMR is y mass %.
Dependencies are inferred from the claim text.