Negative thermal expansion material, method for producing the same, and composite material
AssigneeNippon Chemical Industrial Co., Ltd.
InventorsJunya Fukazawa, Takuma Kato, Toru Hata
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Abstract
An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms and represented by the following general formula (1), CuxMyVzOt (1). In general formula (1), M represents a metallic element with an atomic number of 11 or more other than Cu, V, and Al, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, 1.00≤x+y≤3.00, and a molar number of the Al atoms in terms of atoms>a molar number of M atoms in terms of atoms if an M element is contained.
Claims12
A negative thermal expansion material, comprising copper vanadium composite oxide powder dissolving Al atoms at a content of 1000 to 26000 ppm by mass and represented by the following general formula (1):
- CuxMyVzOt (1)
- wherein M represents a metallic element with an atomic number of 11 or more other than Cu, V, and Al, 1.60≤x≤2.40, 0.00≤y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, 1.60≤x+y≤2.80, and a molar number of the Al atoms in terms of atoms>a molar number of M atoms in terms of atoms if an M element is contained,
- wherein the copper vanadium composite oxide powder has a crystal structure with a single phase of a ziesite phase (β-phase) or with a mixed phase of a ziesite phase (β-phase) and a blossite phase (α-phase).
Dependencies are inferred from the claim text.