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US 12,297,098 B2Granted
Systems and methods for temperature sensor access in die stacks
AssigneeMicron Technology, Inc.
InventorGary L. Howe
Life of this patent
Estimating the term…
Abstract
A memory device may include a memory array including a plurality of memory cells and a die stack including at least a portion of the plurality of memory cells. The memory device may also include multiple temperature sensors each designed to output a temperature code corresponding to the temperature of a respective die of the die stack. One die of the die stack is then designed to output the temperature code corresponding to the hottest die of the die stack.
Claims11
A memory device comprising:
- a memory array comprising a plurality of memory cells, wherein the memory device comprises a double data rate type five synchronous dynamic random access memory (DDR5 SDRAM);
- a die stack comprising at least a portion of the plurality of memory cells;
- and
- a plurality of temperature sensors each configured to output a temperature code corresponding to the temperature of a respective die of the die stack, wherein a first die of the die stack comprises compare logic configured to compare the temperature code of the first die of the die stack to the temperature code of a second die of the die stack and to output the temperature code corresponding to the hottest die between the first die and the second die based on the comparison, and wherein one die of the die stack is configured to output the temperature code corresponding to the hottest die of the die stack.
1 more element
Dependencies are inferred from the claim text.