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US 12,296,536 B1Granted
Method and apparatus for powder removal in an additive manufacturing system
AssigneeSakuu Corporation
InventorsMorteza Vatani, Karl Littau, Seyed Mohammad Sajadi
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Abstract
An improved method and apparatus are provided for removing powder in an additive manufacturing system. In one implementation for removing non-patterned powder from a substrate having a patterned powder portion, and a non-patterned powder, at least one laser having beam parameters is applied to the non-patterned powder for a period of time sufficient to remove the non-patterned powder from the substrate.
Claims23
A method for removing non-patterned powder from a substrate having a patterned powder portion and a non-patterned powder deposited thereon, comprising:
- applying at least one laser having beam parameters to the non-patterned powder for a period of time sufficient to cause the non-patterned powder to become dislodged and removed from the substrate while leaving the patterned powder portion on the substrate;
- configuring the beam parameters of the at least one laser so that power from the at least one laser is absorbed by materials of the non-patterned powder thereby dislodging and removing the non-patterned powder from an upper surface of the substrate without damaging the substrate, the dislodged and removed non-patterned powder being reusable;
- and
- causing remaining non-patterned powder that has been dislodged from the substrate to be removed from the upper surface of the substrate.
1 more element
Dependencies are inferred from the claim text.