Processing apparatus and processing method for removal processing with a light beam and having a workpiece position measurement system

A processing apparatus for performing removal processing on a first workpiece by irradiating the first workpiece with a light beam, the processing apparatus comprising:

• a first holding system that has a first holding member on which the first workpiece is placed and that is configured to move the first holding member to move the first workpiece held by the first holding member;
• a beam irradiation system including a condensing optical system configured to emit the light beam;
• a measurement system including a three-dimensional measuring device configured to acquire position information of the first workpiece held by the first holding member;
• a controller;
• and
• a second holding system that has a second holding member on which a second workpiece, which is different from the first workpiece, is placed and that moves the second holding member to move the second workpiece held by the second holding member, wherein
• the controller performs control such that
• the removal processing is performed on a target portion of the first workpiece while the first holding member and the light beam from the condensing optical system are relatively moved, and
• while the removal processing is performed on the first workpiece held by the first holding member, position information of the second workpiece held by the second holding member is acquired with the measurement system.