Electronic package device and method of operating the same
AssigneeRealtek Semiconductor Corp.
InventorChih-Chiang Wang
Life of this patent
Estimating the term…
Abstract
An electric package device is provided, including a first chip and a second chip. The first chip includes a first conductive pad. The second chip includes a second conductive pad. The second conductive pad couples to the first conductive pad through a connection wire. In some embodiments, the first chip includes a first signal control circuit that receives, in response to a selection signal, one of multiple input signals as a first signal, filters the first signal, and outputs the filtered first signal, as a second signal, from the first conductive pad to the second conductive pad.
Claims17
An electronic package device, comprising:
- a first chip having a first conductive pad;
- and
- a second chip having a second conductive pad coupled to the first conductive pad through a connection wire, wherein the first chip comprises:
- a first signal control circuit configured to receive, in response to a selection signal, one of a plurality of input signals as a first signal, filter the first signal, and output the filtered first signal as a second signal from the first conductive pad to the second conductive pad,
- wherein the first signal control circuit is further configured to amplify the first signal, based on a first gain value, to generate the second signal.
A method of operating an electronic package device, comprising:
- receiving, by a multiplexer, in response to a selection signal, one of a plurality of input signals as a first signal;
- filtering, by a first filter circuit, the first signal, and amplifying, based on a first gain value, the first signal to output a second signal;
- and
- filtering, by a second filter circuit different from the first filter circuit, the second signal received from a connection wire to output a third signal to a driver circuit,
- wherein the first gain value is associated with a resistance value of a resistor that is coupled between the multiplexer and an output terminal of the first filter circuit.
An integrated circuit, comprises:
- a first chip comprising a first signal control circuit configured to selectively amplify, based on a first gain value, one of a plurality of input signals to output a first signal;
- and
- a second chip comprising a second signal control circuit and coupled to the first signal control circuit, wherein the second signal control circuit is configured to perform filtering on the first signal and to amplify, based on a second gain value different from the first gain value, the first signal to output a second signal to a driver circuit,
- wherein the first gain value is greater than the second gain value.
Dependencies are inferred from the claim text.