RF communication device without temporary connection line, and manufacturing method

A method of manufacturing an RF communication device, the method comprising:

• providing a wafer with a plurality of RF communication device preforms, wherein each of the preforms include
• a first pad configured to be electrically coupled to a first antenna segment, and configured to receive RF energy from the first antenna segment;
• an RF antenna circuit electrically coupled to the first pad;
• a second pad configured to be electrically coupled to the first antenna segment, and configured to receive the RF energy from the first antenna segment;
• a test circuit configured to generate a control signal based on the RF energy;
• and
• a first control element coupled between the test circuit and the second pad, wherein the first control element is configured to receive the control signal, wherein when the control signal has a first value, the first control element is configured to operate in a test mode in which the first control element electrically couples the test circuit and the second pad, and when the control signal has a second value, the first control element is configured to operate in an RF communication mode in which the first control element electrically isolates the test circuit from the second pad.