Yield improvements for three-dimensionally stacked neural network accelerators

A method of routing data in device comprising a plurality of stacked dies, each die comprising a plurality of tiles, wherein each tile comprises:

• a processing element configured to perform one or more computations;
• an inductive coil that is reconfigurable to receive data from a vertically adjacent tile of another die in the plurality of stacked dies;
• and
• switching circuitry that is reconfigurable to select between routing input data received through the inductive coil to the processing element or routing the input data to a processing element bypass that bypasses the processing element,
• the method comprising routing, by switching circuitry of a first tile of a first die of the plurality of stacked dies in accordance with a dataflow configuration of the device, input data received by the first tile to a processing element bypass of the first tile.

A method of reconfiguring a device comprising a plurality of stacked dies, each die comprising a plurality of tiles, wherein each tile comprises:

• a processing element configured to perform one or more computations;
• an inductive coil that is reconfigurable to receive data from a vertically adjacent tile of another die in the plurality of stacked dies;
• and
• switching circuitry that is reconfigurable to select between routing input data received through the inductive coil to the processing element or routing the input data to a processing element bypass that bypasses the processing element,
• the method comprising reconfiguring switching circuitry of a first tile of the plurality of tiles to route input data to a processing element bypass of the first instead of a processing element of the first tile.