Window or surface of a vehicle comprising at least one optoelectronic component

A method of manufacturing an optoelectronic device, comprising:

• overlapping a first and a second layer segment of a plurality of layer segments along a first direction such that the first and the second layer segment are forming a respective overlapping boundary region;
• wherein at least one optoelectronic component is arranged on at least one of the layer segments;
• wherein the first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad;
• wherein the at least one first and the at least one second contact pad are arranged in the respective boundary region facing each other;
• wherein the at least one first and the at least one second contact pad each comprises a plurality of nanowires at least partially made of a conductive material including copper, gold, or nickel;
• and
• mechanically and electrically connecting the overlapping layer segments.

A window of a vehicle, comprising:

• a transparent carrier layer;
• a transparent dielectric layer arranged on the carrier layer;
• at least one first structured conductor arranged in between the carrier layer and the dielectric layer;
• at least one optoelectronic component, in particular a LED, arranged on the surface of the dielectric layer opposite to the carrier layer;
• at least one conductive via through the dielectric layer electrically connecting the at least one first structured conductor with the at least one optoelectronic component;
• and
• a transparent covering layer arranged on the surface of the dielectric layer opposite to the carrier layer, wherein the covering layer covers the at least one optoelectronic component completely, or
• an optoelectronic array, comprising:
• a transparent carrier layer, a plurality of optoelectronic components arranged on a first surface of the transparent carrier layer in a first matrix,
• wherein each optoelectronic component is associated with a pixel,
• at least two integrated circuits, in particular μICs, arranged on the first surface of the transparent carrier layer,
• wherein each integrated circuit is connected to at least one of the plurality of optoelectronic components,
• a first contact area along a short edge of the transparent carrier layer,
• at least one first data line to connect the at least two integrated circuits with the first contact area,
• or
• an optoelectronic device comprising:
• a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer,
• wherein at least one optoelectronic component is arranged on at least one of the plurality of layer segments,
• wherein a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region,
• wherein the first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad,
• wherein the at least one first and the at least one second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected, and
• wherein the at least one first and the at least one second contact pad each comprises a plurality of nanowires at least partially made of a conductive material such as for example copper, gold or nickel,
• or
• an at least partially transparent substrate, in particular a flexible foil, being arranged between a carrier layer and a cover layer,
• at least one optoelectronic component, in particular an LED and optionally a sensor, arranged on the substrate,
• at least one structured first conductor arranged on the substrate being coupled to the at least one optoelectronic component, and
• at least one first inductive element arranged between the carrier layer and the cover layer being electrically coupled to the at least one structured first conductor,
• wherein the at least one first inductive element is configured to generate a power signal for operating the at least one optoelectronic component when excited by a magnetic field.