Composite pre-bonding treatment method
AssigneeMitsubishi Heavy Industries, Ltd.
InventorsHiromichi Akiyama, Kiyoka Takagi
Life of this patent
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AssigneeMitsubishi Heavy Industries, Ltd.
InventorsHiromichi Akiyama, Kiyoka Takagi
Estimating the term…
An object is to provide a composite pre-bonding treatment method that stabilizes quality of a bonded part. The present disclosure provides a composite pre-bonding treatment method performed when bonding a composite material to a member. The method includes: (S2) attaching an absorber adapted to absorb a contaminant to a surface of a prepreg laminate that is a precursor of the composite material; (S3) covering the prepreg laminate with a packaging material from above the absorber; (S4) vacuuming the packaging material and heating the prepreg laminate at a temperature lower than a curing temperature of a prepreg; (S5) then removing the packaging material; (S6) peeling off the absorber; (S7) attaching, to a surface of the prepreg laminate with the absorber peeled off, a release member that does not transfer silicone or fluorine to a resin, and then (S9) curing the prepreg laminate to mold the composite material; and (S11) peeling off the release member from the composite material before bonding the member.
A composite pre-bonding treatment method performed when bonding a composite material to a member, the composite pre-bonding treatment method comprising:
A composite pre-bonding treatment method performed when bonding a composite material to a member, the composite pre-bonding treatment method comprising:
Dependencies are inferred from the claim text.