Method of manufacturing flexible substrate
AssigneeJapan Display Inc.
InventorTakumi Sano
Life of this patent
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Abstract
According to one embodiment, a method of manufacturing a flexible substrate, includes forming a release layer on a glass substrate, forming an insulating base, forming a plurality of insulating layers, wiring lines and electrical elements, asking the release layer, the insulating base and the plurality of insulating layers from above to the glass substrate via a mask, forming an upper resin layer, removing the glass substrate and the release layer by peeling off an interface between the release layer and the insulating base and forming a lower resin layer so as to be in contact with a lower surface of the insulating base and a lower surface of the upper resin layer.
Claims8
A method of manufacturing a flexible substrate, comprising:
- forming a release layer on a glass substrate;
- forming an insulating base on the release layer;
- forming a plurality of insulating layers, wiring lines and electrical elements on the insulating base;
- ashing the release layer, the insulating base and the plurality of insulating layers from above to the glass substrate via a mask;
- forming an upper resin layer which covers the release layer, the insulating base, and the plurality of insulating layers;
- removing the glass substrate and the release layer by peeling off at an interface between the release layer and the insulating base;
- and
- forming a lower resin layer so as to be in contact with a lower surface of the insulating base and a lower surface of the upper resin layer.
A method of manufacturing a flexible substrate, comprising:
- forming a release layer on a glass substrate;
- forming a barrier layer on the release layer;
- patterning the barrier layer;
- forming an insulating base on the barrier layer and the release layer;
- forming a plurality of insulating layers, wiring lines and electrical elements on the insulating base;
- attaching a temporary film above the electrical elements;
- removing the glass substrate and the release layer by peeling off at an interface between the release layer and the barrier layer;
- etching the insulating base and the plurality of insulating layers from below to the temporary film by laser irradiation using the barrier layer as a mask;
- forming a lower resin layer which covers the barrier layer, the insulating base and the plurality of insulating layers from below;
- removing the temporary film;
- and
- forming an upper resin layer so as to be in contact with an upper surface of the lower resin layer.
Dependencies are inferred from the claim text.