Method for manufacturing mounting substrate, and component mounting device

A component mounter comprising:

• a component supply mechanism that supplies a component;
• a first outer shape position acquisition unit that images the component supplied by the component supply mechanism from a first direction to acquire a first outer shape position of the component;
• a feature portion position acquisition unit that images the component supplied by the component supply mechanism from the first direction to acquire a position of a feature portion formed on the component;
• a deviation amount calculator that calculates a deviation amount of the position of the feature portion with respect to the first outer shape position from the first outer shape position and the position of the feature portion;
• a component mounting unit that holds the component with a holding member to mount the component on a board;
• a controller that controls an operation of the component mounting unit;
• a second outer shape position acquisition unit that images, from a second direction, the component held by the holding member to acquire a second outer shape position of the component, the second direction being different from the first direction;
• and
• an outer shape position variation calculator that calculates a difference in positions of a first outer shape position of the component acquired again by the first outer shape position acquisition unit and the previously acquired first outer shape position of the component,
• wherein the controller causes the component mounting unit to mount the component to a board so that the feature portion of the component is positioned on a target position of the board based on the second outer shape position and the deviation amount, and
• wherein when the difference in the positions calculated by the outer shape position variation calculator is within a predetermined range, the controller causes the holding member to hold the component.

A method for manufacturing a mounting board, the method comprising:

• a first outer shape position acquisition step of imaging a component from a first direction to acquire a first outer shape position of the component;
• a feature portion position acquisition step of imaging the component from the first direction to acquire a position of a feature portion formed on the component;
• a calculation step of calculating a deviation amount of the position of the feature portion with respect to the first outer shape position from the first outer shape position and the position of the feature portion;
• a holding step of holding the component with a holding member;
• a second outer shape position acquisition step of imaging, from a second direction, the component held by the holding member to acquire a second outer shape position of the component, the second direction being different from the first direction;
• and
• a mounting step of mounting the component to a board so that the feature portion of the component is positioned on a target position of the board based on the second outer shape position and the deviation amount,
• wherein when the deviation amount is larger than a predetermined range, the component is not held by the holding member.