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US 12,288,964 B2Granted
Method for manufacturing optical semiconductor waveguide window structure
AssigneeNippon Telegraph and Telephone Corporation
InventorsNaoki Fujiwara, Takahiko Shindo, Shigeru Kanazawa, Meishin Chin
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Abstract
Provided is a semiconductor light source element or an optical device including a semiconductor optical waveguide of a high-mesa semi-insulated embedded structure having a window structure made of the same material as an overclad layer at a light emission end, and a method for manufacturing thereof, in which an active layer at a portion of the window structure is removed, and then the same layer as the overclad layer is formed.
Claims4
A method for manufacturing a semiconductor light source element, the method comprising:
- forming an active layer on an InP substrate, wherein the active layer is a crystal grown layer and wherein a crystal orientation of a surface thereof was a (1 0 0) plane and an orientation flat thereof was a (0 −1 −1) plane;
- forming a first etching mask on the active layer, and removing a part of the active layer, wherein a remaining part of the active layer is perpendicular to the orientation flat;
- forming an EA (Electro-Absorption) layer, wherein the EA layer is a crystal grown layer and wherein the EA layer forms a core layer of an EA modulator, without removing the first etching mask;
- removing the first etching mask and forming a second etching mask on the active layer;
- partially removing the EA layer, such that a region serving as a window structure remains, wherein the region remaining is wider than a mesa stripe;
- removing the second etching mask and then forming the window structure by forming an overclad layer on an entire surface;
- and
- forming a third etching mask on the overclad layer, and then forming the mesa stripe by removing each of the overclad layer, the active layer, the EA layer, and a part of the InP substrate, wherein the mesa strip has a height of at least 3 μm.
5 more elements
Dependencies are inferred from the claim text.