Secondary side heatsink techniques for optical and electrical modules

A method comprising:

• providing a system for use in a hardware platform for networking, computing, and/or storage, the system comprising:
• a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side;
• one or more optical components disposed on a surface of the printed circuit board assembly on the primary side of the printed circuit board assembly, wherein the optical components include a pluggable optical module which is removable from the printed circuit board assembly;
• and
• a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is in thermal communication with and disposed via a direct thermal interface opposite of the pluggable optical module disposed on the primary side, for thermal management, when the pluggable module is inserted.