# US 12,288,757 B2 · Arrangement comprising an integrated circuit package and a heatsink element > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,288,757 B2 - Document ID: US12288757B2 - Status: Granted - Kind: B2 - Application number: 17/570,948 - Filed: 2022-01-07 - Published: 2022-07-07 - Granted: 2025-04-29 - Earliest claimed: 2021-01-07 - Assignees: Sivers Wireless AB - Applicants: Sivers Wireless AB - Inventors: Erik Öjefors; Dragos Dancila; Imran Aziz; Johanna Hanning - Web page: https://patentgrep.com/patent/US12288757B2 ## CPC - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 13/02: Waveguide horns - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/02: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/611: {for connecting multiple chips together} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H01Q 9/16: with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole (H01Q9/44 takes precedence) - H10W 40/611: {Bolts or screws} - H10W 44/248: {for antennas} - H10W 74/117: {the substrate having spherical bumps for external connection} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An arrangement (100) is provided. The arrangement comprises an integrated circuit package (2). The integrated circuit package comprises a first side (2a) which comprises interconnect elements, and a second side (2b) which is opposite to the first side (2a). The integrated circuit package further comprises at least one antenna element (25), and a heatsink element (1) arranged on the second side (2b) of the integrated circuit package (2). The heat sink element comprises at least one passage (10). The at least one passage (10) extends through the heatsink element (1). A first opening (13) of the at least one passage (10) is arranged at a respective antenna element (25) of the at least one antenna element. The at least one passage (10) is configured to increase the gain of the respective antenna element (25). ## Claims ### Claim 1 A system comprising: an integrated circuit package comprising, on a first side, interconnect elements and at least one antenna; and a heatsink arranged on a second side of the integrated circuit package opposite to the first side, the heatsink comprising at least one passage extending through the heatsink, the at least one passage having an opening disposed over the antenna; wherein the passage is configured to increase the gain of the antenna. ### Claim 2 (depends on 1) The system of claim 1, wherein integrated circuit package has two antennas. ### Claim 3 (depends on 1) The system of claim 1, wherein integrated circuit package comprises a die portion and a first fan-out portion. ### Claim 4 (depends on 3) The system of claim 3, wherein the antenna is disposed in the first fan-out portion. ### Claim 5 (depends on 3) The system of claim 3, further comprising a second fan-out portion spaced apart from the first fan-out portion. ### Claim 6 (depends on 5) The system of claim 5, wherein integrated circuit package has two antennas. ### Claim 7 (depends on 6) The system of claim 6, wherein a receiving antenna is disposed in the first fan-out portion and a transmitting antenna is disposed in the second fan-out portion. ### Claim 8 (depends on 1) The system of claim 1, wherein the antenna comprises a receiving antenna and a transmitting antenna. ### Claim 9 (depends on 1) The system of claim 1, wherein the antenna comprises a dipole antenna. ### Claim 10 (depends on 1) The system of claim 1, wherein the integrated circuit package further comprises an embedded level ball grid array package. ### Claim 11 (depends on 1) The system of claim 1, wherein the passage is configured as a horn antenna. ### Claim 12 (depends on 1) The system of claim 1, further comprising a printed circuit board engaging the first side of the integrated circuit package. ### Claim 13 (depends on 12) The system of claim 12, wherein the printed circuit board comprises a reflector. ### Claim 14 (depends on 13) The system of claim 13, wherein the reflector is aligned with the antenna. ### Claim 15 A heatsink for engaging an integrated circuit package comprising at least one antenna, the heatsink comprising: a socket recessed into a bottom of the heatsink for receiving the integrated circuit package; a first opening disposed adjacent to the antenna and extending from the socket to at least one passage extending through the heatsink, the passage terminating in a second opening of the heatsink; wherein the passage is configured to increase the gain of the antenna. ### Claim 16 (depends on 15) The heatsink of claim 15, wherein the second opening is arranged at least in part at a top of the heatsink. ### Claim 17 (depends on 15) The heatsink of claim 15, wherein the second opening is arranged at least in part at a side of the heatsink. ### Claim 18 (depends on 15) The heatsink of claim 15, wherein the second opening is larger than the first opening. ### Claim 19 (depends on 15) The heatsink of claim 15, wherein the passage is configured as a horn antenna. ### Claim 20 (depends on 15) The heatsink of claim 15, further comprising a pair of attachment members extending on opposite sides of the heatsink, wherein bottoms of the attachment members are flush with the bottom of the heatsink.