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US 12,288,690 B2Granted
Diamond semiconductor system and method
AssigneeAkhan Semiconductor, Inc.
InventorAdam Khan
Life of this patent
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Abstract
Disclosed herein is a new and improved system and method for fabricating diamond films by first seeding a surface of a transparent substrate. A diamond layer that is at least one of nanocrystalline and ultrananocrystalline can be deposited upon the surface of the transparent substrate and both the diamond layer and the transparent substrate modified to incorporate substitutional atoms.
Claims9
A method of fabricating diamond films, the method including the steps of:
- seeding a surface of a transparent substrate;
- depositing a diamond layer that is at least one of nanocrystalline and ultrananocrystalline upon the surface of the transparent substrate;
- and
- modifying both the diamond layer and the transparent substrate to incorporate substitutional atoms.
1 more element
Dependencies are inferred from the claim text.