Power supply control device
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsRyosuke Masuda, Masayuki Kato, Shunichi Sawano, Ryohei Sawada
Life of this patent
Estimating the term…
Abstract
A power supply control device is to be installed in a vehicle. The power supply control device controls power supply via a semiconductor switch and a fuse by turning the semiconductor switch ON or OFF. The semiconductor switch and the fuse are mounted on a circuit board. In the fuse, two long plate-shaped terminals are arranged in a row. The fusing portion and a part of the two terminals are covered with a housing having heat resistance. The two terminals are disposed in a current path of a current flowing through the semiconductor switch. The current flows through the fusing portion. If the temperature of the fusing portion exceeds a predetermined temperature, the fusing portion is fused.
Claims11
A vehicle power supply control device that controls power supply via a semiconductor switch by switching the semiconductor switch ON or OFF, comprising:
- a fuse;
- and
- a circuit board on which the semiconductor switch and the fuse are mounted, the circuit board including an insulating substrate, a pair of through holes passing through the insulating substrate and a plurality of substrate plating portions covering the insulating substrate, wherein the each of the pair of through holes has a first length,
- wherein the fuse includes:
- a pair of long plate-shaped terminals arranged in a row, the pair of long plate-shaped terminals includes a first plate portion and a second plate portion extending from the first plate portion, the first plate portion having a length longer than the first length of the pair of through holes and a width of the first plate portion is the same as a width of the second plate portion;
- a fusing portion connected to two terminals of the plurality of terminals;
- and
- a housing covering the fusing portion and a part of the terminals, and
- the two terminals of the plurality of terminals are arranged in a current path of a current flowing through the semiconductor switch,
- the current flows through the fusing portion,
- the fusing portion is fused when a temperature of the fusing portion exceeds a predetermined temperature, and
- the housing is heat-resistant;
- and
- wherein a distal end of the first plate portion is pressed against a top surface of a top one of the plurality of substrate plating portions and the first plate portion of the pair of terminals respectively connected to the substrate plating portions by soldering and the second plate portion of the pair of terminals are disposed within the pair of through holes and connected within the pair of through holes by soldering.
Dependencies are inferred from the claim text.