Adhesive for processing a microelectronic substrate, and related methods
AssigneeSeagate Technology LLC
InventorsZubair Ahmed Khan, Dat Quach, Andrew Habermas, Joel William Hoehn
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Abstract
Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.
Claims20
Elastomeric adhesive film comprising adhesive polymer, wherein the adhesive polymer comprises one or more polyacrylates, the adhesive film being useful to adhere a microelectronic device substrate to a carrier during a step of lapping a surface of the microelectronic substrate, the adhesive film having:
- an elastic modulus in a range from 100 to 500 kilopascals measured at 25 degrees Celsius, a Tan Delta in a range from 0.05 to 0.2 measured at 25 degrees Celsius.
Dependencies are inferred from the claim text.