Housings for electronic devices and memory devices

An article for housing at least a portion of an electronic device, the article comprising:

• a first component comprising a thermoplastic and a biodegradable filler or polymer, wherein the thermoplastic is present in an amount of 55 wt % to about 65 wt %, wherein the biodegradable filler or polymer is present in an amount of 35 wt % to about 45 wt %, and wherein the first component has:
• a density from about 1.05 g/cm3 to about 1.25 g/cm3;
• a heat deflection temperature (HDT) from about 140° C. to about 180° C.;
• a tensile strength of about 110 MPa to about 200 MPa;
• a flexural strength of about 150 MPa to about 200 MPa;
• and
• a notched impact strength of about 40 kJ/m2 to about 70 kJ/m2;
• and
• a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers, wherein the plurality of layers comprises at least three layers, wherein each layer of the plurality of layers has a different composition,
• the article having:
• a scratch visibility load (ISO 4586-2) of about 200 gms or more;
• an electrostatic discharge (ESD) static voltage (ANSI/ESD S20.20) of about 100 V or less;
• a thermal conductivity (ISO 22007-2) of about 0.28 W/mK or more;
• or
• combinations thereof.