Wireless communication device manufacturing system

A method of manufacturing a wireless communication device comprising:

• sucking and holding a radio-frequency integrated circuit (“RFIC”) module with a plurality of suction nozzles that circle on a mounting head;
• conveying an antenna base material to a mounting position;
• heating a hot melt adhesive layer of the RFIC module with an optical heating apparatus that irradiates the RFIC module with light to heat the hot melt adhesive layer;
• bonding the RFIC module when the hot melt adhesive layer is softened by heating of the optical heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and
• capacitively coupling an antenna pattern and a terminal electrode through the hot melt adhesive layer.

A wireless communication device manufacturing system comprising:

• a mounting head including a plurality of suction nozzles that circle on the mounting head and are configured to hold a radio-frequency integrated circuit (“RFIC”) module;
• a conveyance apparatus configured to convey an antenna base material to a mounting position;
• a preheating apparatus configured to preheat the antenna base material disposed at the mounting position;
• and
• a heater included in the mounting head and configured to heat a hot melt adhesive layer of the RFIC module,
• wherein the heater heats the hot melt adhesive layer of the RFIC module in a state of being held by the plurality of suction nozzle of the mounting head, and
• wherein the heater is an optical heating apparatus that irradiates the RFIC module with light to heat the hot melt adhesive layer.