Fine-grain dynamic solid-state cooling system

A method of cooling a heat source having a plurality of sub-regions comprising:

• sampling temperatures of a plurality of sensor sub-units having first sides thermally connected to the plurality of sub-regions of the heat source and having opposing second sides, the plurality of sensor sub-units made of an anisotropic material;
• selectively cooling one or more of the plurality of sub-regions of the heat source by applying power to one or more of a plurality of solid-state cooling sub-units arranged in a grid, each solid-state cooling sub-unit including a cold side and a hot side, wherein the cold side of each given solid-state cooling sub-unit is thermally coupled to the second side of a corresponding sensor sub-unit;
• and
• dissipating heat from the heat source and additional waste heat generated from powering the solid state cooling sub-units with a plurality of heat exchanger channels, each heat exchanger channel thermally coupled to the hot side of a given solid-state cooling sub-unit, wherein at least one surface of at least one of the plurality of heat exchanger channels not coupled to the hot sides of the solid-state cooling sub-units includes a coating configured to boost conversion of heat energy being dissipated by the at least one heat exchanger channel into infrared radiation.

A cooling system comprising:

• a plurality of sensor sub-units made of an anisotropic material arranged in at least one sensor mesh and having first sides configured to be thermally connected to a heat source and opposing second side, the heat source including a plurality of sub-regions that correspond with the first side of the sensor mesh;
• a plurality of solid-state cooling sub-units arranged in at least one cooler mesh that is stacked together with the at least one sensor mesh, the at least one cooler mesh including a cold side and a hot side, wherein the cold side of the cooler mesh thermally connects to the second side of the sensor mesh and is configured to dissipate heat from the sub-regions of the heat source;
• and
• a plurality of heat exchanger channels thermally connected to the hot side of the at least one cooler mesh and configured to dissipate heat from the sub-regions of the heat source and additional waste heat generated from powering the cooler mesh, wherein at least one surface of at least one of the plurality of heat exchanger channels not connected to the hot side of the cooler mesh includes a coating configured to boost conversion of heat energy being dissipated by the at least one of the plurality of heat exchanger channels into infrared radiation;
• and
• a controller coupled to the at least one sensor mesh and the at least one cooler mesh and configured to determine one or more sub-regions of the heat source to cool.