Diamond composite body, substrate, diamond, tool including diamond, and method for manufacturing diamond
AssigneeSumitomo Electric Industries, Ltd.
InventorsYoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya
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Abstract
Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.
Claims1
A diamond, comprising:
- a single crystal diamond layer having a set of main surfaces;
- and
- a substrate containing implanted ions arranged on at least one of the main surfaces of the single crystal diamond layer,
- wherein the substrate is divided into two layers by the implanted ions, the substrate containing implanted ions having line-shaped or lattice-shaped grooves penetrating to the single crystal diamond layer, and wherein the width of at least two of the grooves is more than or equal to 0.1 μm and less than or equal to 30 μm.
Dependencies are inferred from the claim text.