Optoelectronic component and method for manufacturing an optoelectronic component
AssigneeOSRAM Opto Semiconductors GmbH
InventorIvar Tangring
Life of this patent
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Abstract
In an embodiment an optoelectronic component includes a carrier with a mounting area, an optoelectronic semiconductor chip, a dielectric protective layer and a dielectric encapsulation, wherein the protective layer is directly located at the mounting area in a chip mounting region, wherein the semiconductor chip is located at the protective layer in the chip mounting region and is electrically conductively connected with the carrier, wherein the encapsulation is directly located at the mounting area in a region adjacent to the chip mounting region and is directly located at the protective layer in an overlap region, and wherein the encapsulation is arranged exclusively in the region adjacent to the semiconductor chip.
Claims17
An optoelectronic component comprising:
- a carrier with a mounting area;
- an optoelectronic semiconductor chip;
- a conversion element;
- a dielectric protective layer;
- and
- a dielectric encapsulation,
- wherein the protective layer is directly located at the mounting area in a chip mounting region,
- wherein the semiconductor chip is located at the protective layer in the chip mounting region and is electrically conductively connected with the carrier,
- wherein the encapsulation is directly located at the mounting area in regions adjacent to the chip mounting region and is directly located at the protective layer in an overlap region,
- wherein the encapsulation is arranged exclusively in the regions adjacent to the semiconductor chip,
- wherein the semiconductor chip is configured to generate a primary electromagnetic radiation,
- wherein the conversion element is configured to convert at least a portion of the primary radiation into a secondary radiation,
- wherein the protective layer has a higher reflectivity for the primary radiation than for the secondary radiation, and
- wherein the encapsulation has a higher reflectivity for the secondary radiation than for the primary radiation.
An optoelectronic component comprising:
- a carrier with a mounting area;
- an optoelectronic semiconductor chip;
- a dielectric protective layer;
- and
- a dielectric encapsulation,
- wherein the protective layer is directly located at the mounting area in a chip mounting region,
- wherein the semiconductor chip is located at the protective layer in the chip mounting region and is electrically conductively connected with the carrier,
- wherein the encapsulation is directly located at the mounting area in regions adjacent to the chip mounting region and is directly located at the protective layer in an overlap region,
- wherein the encapsulation is arranged exclusively in regions adjacent to the semiconductor chip, and
- wherein the encapsulation is a layer comprising a constant thickness over its entire extension with deviations of at most 30% from an average thickness.
Dependencies are inferred from the claim text.