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US 12,281,195 B2Granted
Epoxy resin composition, gas barrier film, and laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKazuki Kouno, Ryoma Hashimoto
Life of this patent
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Abstract
Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.
Claims14
An epoxy resin composition comprising:
- an epoxy resin;
- an epoxy resin curing agent comprising an amine-based curing agent;
- and
- at least one acidic compound selected from the group consisting of p-toluenesulfonic acid, dodecylbenzene sulfonic acid, lactic acid, salicylic acid, 2-acrylamido-2-methylpropane sulfonic acid, and phosphoric acid,
- wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0 and
- wherein the epoxy resin comprises, as a main component, an epoxy resin having a glycidylamino group derived from meta-xylylenediamine.
3 more elements
An epoxy resin composition comprising:
- an epoxy resin;
- an epoxy resin curing agent comprising an amine-based curing agent;
- and
- at least one acidic compound selected from the group consisting of p-toluenesulfonic acid, dodecylbenzene sulfonic acid, lactic acid, salicylic acid, 2-acrylamido-2-methylpropane sulfonic acid, and phosphoric acid,
- wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0, and
- wherein a ratio of the number of active amine hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin is more than 1.0 and 5.0 or less.
3 more elements
A gas barrier film comprising:
- a substrate having at least one surface constituted of an inorganic substance;
- and
- a cured resin layer,
- wherein the cured resin layer is a cured product of an epoxy resin composition comprising:
- an epoxy resin;
- an epoxy resin curing agent comprising an amine-based curing agent;
- and
- at least one acidic compound selected from the group consisting of p-toluenesulfonic acid, dodecylbenzene sulfonic acid, lactic acid, salicylic acid, 2-acrylamido-2-methylpropane sulfonic acid, and phosphoric acid,
- wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0.
6 more elements
Dependencies are inferred from the claim text.