Multilayer structure, method of producing the same, and packaging container
AssigneePlantic Technologies Ltd.
InventorsAkihiro Kotaka, Masahiko Ota, Nicholas John McCaffrey
Life of this patent
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Abstract
The present invention relates to a multilayer structure including a starch layer (A), an adhesive layer (B), and a base material layer (C) in the order mentioned. In this multilayer structure, a material constituting the starch layer (A) comprises a starch and water; a material constituting the adhesive layer (B) comprises a thermoplastic resin having a density of 0.920 g/cm3 or lower and has an acid value of 0.3 mgKOH/g or higher; and the base material layer (C) is a layer having a tensile elastic modulus of 100 MPa or higher.
Claims9
A multilayer structure comprising, in the following order:
- a starch layer (A), comprising a starch and water;
- an adhesive layer (B), comprising a thermoplastic resin having a density of 9.20 g/cm3 or lower and an acid value of 0.3 mgKOH/g or higher;
- and
- a base material layer (C), having a tensile elastic modulus of 100 MPa or higher,
- wherein
- the adhesive layer is disposed on the base material layer and the starch layer is disposed on the adhesive layer.
Dependencies are inferred from the claim text.