Hybrid through hole for solid state intrusion detection

An information handling system comprising:

• a printed circuit board including a through hole via, the through hole via having top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material;
• a screw to be placed in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board;
• a service panel in physical communication with the screw, wherein the service panel prevents access to components within the information handling system;
• a conductive sleeve to be inserted within the printed circuit board, wherein the conductive sleeve is to provide electrical communication between the screw, the top section of the through hole via, and the bottom section of the through hole via, and to provide proper alignment of the screw within the through hole via;
• and
• a processor to:
• determine whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via;
• and
• based on a determination of the electrical circuit being formed, provide a first indication that no intrusion has been made into the information handling system.

A method comprising:

• drilling a first partial via into a top surface of a printed circuit board;
• drilling a second partial via into a bottom surface of the printed circuit board;
• plating the first and second vias with a conductive plating material;
• drilling a through via to connect the first and second partial vias, wherein the through via includes top and bottom sections plated with the conductive plating material and a middle section without any conductive plating material;
• and
• inserting a conductive sleeve within the middle section of the through via.