Multilayer electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHee Sun Chun, Jin Woo Kim, Tae Hyung Kim, Hyo Ju Lee, Seok Hyun Yoon, Jeong Ryeol Kim
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHee Sun Chun, Jin Woo Kim, Tae Hyung Kim, Hyo Ju Lee, Seok Hyun Yoon, Jeong Ryeol Kim
Estimating the term…
A multilayer electronic component includes a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction and external electrodes disposed on the body, wherein at least one of the plurality of dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the core, a ratio of an average size of the core to an average size of the dielectric grains having the core-shell structure is 0.4 or more and 0.8 or less, a ratio ((Dy+Tb)/Sn) of the sum of the moles of dysprosium (Dy) and the moles of terbium (Tb) to the moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and at least one of the dielectric layers has four or more dielectric grains in the first direction.
A multilayer electronic component comprising:
A multilayer electronic component comprising:
Dependencies are inferred from the claim text.