Wafer scheduling method and wafer scheduling apparatus for etching equipment

A wafer scheduling apparatus for an etching equipment, comprising:

• a first obtaining module, configured to obtain a wafer processing request;
• wherein the wafer processing request comprises at least process information of wafers and an equipment processing parameter of the etching equipment;
• a processing module, configured to respond to the wafer processing request, and determine a wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling policy;
• wherein the wafer scheduling parameter is used to determine a transfer time for transferring the wafers to the etching equipment for processing;
• and
• a scheduling module, configured to perform wafer scheduling processing on the wafers by using the wafer scheduling parameter;
• and
• wherein when determining the wafer scheduling parameter corresponding to the process information and the equipment processing parameter based on the process information, the equipment processing parameter, and the preset wafer scheduling policy, the processing module is configured to:
• determine the wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling function;
• wherein when generating the wafer scheduling function, the wafer scheduling apparatus further comprises:
• a second determining module, configured to determine process information and an equipment processing parameter that are corresponding to each type of wafers, and a corresponding standard wafer scheduling parameter;
• and
• a third determining module, configured to:
• for each type of wafers, determine a simulated wafer scheduling parameter of the type of wafers, based on process information, an equipment processing parameter, an initial wafer scheduling function, and a preset buffer time, that are corresponding to the type of wafers;
• and adjust various parameters of the initial wafer scheduling function based on the standard wafer scheduling parameter and the simulated wafer scheduling parameter until all simulated wafer scheduling parameters of all the types of wafers are calculated, to obtain the wafer scheduling function.