Curable composition, film forming method and article manufacturing method

A curable composition containing:

• a polymerizable compound;
• a photopolymerization initiator;
• and a solvent,
• wherein
• the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C.,
• a content of the solvent with respect to the whole curable composition is not less than 70 vol % and not more than 85 vol %,
• a boiling point of the solvent at normal pressure is less than 250° C., and
• the polymerizable compound contains a compound containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

A film forming method of forming a film of a curable composition in a space between a mold and a substrate, comprising:

• an arranging step of discretely arranging a plurality of droplets of a curable composition on the substrate;
• a waiting step of waiting until the plurality of droplets discretely arranged on the substrate combine with their respective adjacent droplets and form a continuous liquid film on the substrate, and a solvent contained in the liquid film volatilizes;
• and
• a contact step of bringing the mold and the liquid film on the substrate into contact with each other after the waiting step,
• wherein the curable composition contains:
• a polymerizable compound;
• a photopolymerization initiator;
• and
• a solvent, and
• wherein
• the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C.,
• a content of the solvent with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %,
• a boiling point of the solvent at normal pressure is less than 250° C., and
• the polymerizable compound contains a compound containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.