Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsJun Yasumoto, Rihoko Watanabe, Teppei Washio, Hiroharu Inoue
Life of this patent
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Abstract
A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan δ=E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
Claims13
A resin composition containing a curable resin,
- a minimum value of loss tangent (tan δ=E″/E′) of a cured product of the resin composition being equal to or greater than 0.04, the loss tangent being a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof, the loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) being obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.,
- wherein a ratio of Max (B) to Max (A) is less than one,
- where Max (B) is a maximum value of the loss tangent of the cured product as measured by the dynamic mechanical analysis at the temperature equal to or higher than 100° C. and equal to or lower than 200° C., and Max (A) is a maximum value of the loss tangent of the cured product as measured by the dynamic mechanical analysis at a temperature equal to or higher than 30° C. and lower than 100° C. and at a temperature higher than 200° C. and equal to or lower than 300° C.
A resin composition containing a curable resin,
- a minimum value of loss tangent (tan δ=E″/E′) of a cured product of the resin composition being equal to or greater than 0.04, the loss tangent being a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof, the loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) being obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.,
- the curable resin including a long-chain-containing compound,
- the long-chain-containing compound including:
- a long-chain hydrocarbon group having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six;
- and
- a first functional group including at least one selected from the group consisting of an epoxy group, a maleimide group, an imide group, and a hydroxyl group.
A resin composition containing a curable resin and a styrene copolymer,
- a minimum value of loss tangent (tan δ=E″/E′) of a cured product of the resin composition being equal to or greater than 0.04, the loss tangent being a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof, the loss modulus (E″), the storage modulus (E′), and the loss tangent (tan δ=E″/E′) being obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.
Dependencies are inferred from the claim text.