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US 12,275,670 B2Granted
Method for joining transparent substrates
AssigneesTadatomo SUGA, iSABers Japan Co. Ltd.
InventorsTadatomo Suga, Yoshiie Matsumoto
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Abstract
A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.
Claims18
A method for bonding transparent substrates,
- preparing a pair of transparent substrates;
- forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates;
- contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates;
- and
- after the pair of transparent substrates are bonded, heating the bonded pair of transparent substrates.
2 more elements
Dependencies are inferred from the claim text.