US 12,275,220 B2 · Method for compressing laminate and method for manufacturing ceramic electronic component including laminate

Abstract

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

Claims17

Dependent claims

A method for compressing a ceramic laminate, comprising:

preparing the ceramic laminate, the ceramic laminate comprising a plurality of dielectric sheets and a conductor pattern disposed thereon;
pressurizing the ceramic laminate from a first pressure to a second pressure;
heating the ceramic laminate from a first temperature to a second temperature;
maintaining compression of the ceramic laminate at the second pressure and the second temperature for a predetermined time;
cooling the ceramic laminate from the second temperature to a third temperature;
and
depressurizing the ceramic laminate from the second pressure to a third pressure,
wherein the second temperature is in a range from 70° C. to 150° C.

5 more elements

A method of compressing a ceramic laminate, comprising:

obtaining the ceramic laminate, the ceramic laminate comprising a plurality of dielectric sheets and a conductor pattern disposed thereon;
applying compression pressure to the ceramic laminate to increase pressure on the ceramic laminate from a first pressure to a second pressure;
heating the ceramic laminate from a first temperature to a second temperature while the ceramic laminate is compressed, the second temperature being in a range from 70° C. to 150° C.;
maintaining the ceramic laminate at the second temperature and under compression at the second pressure for a predetermined period of time;
cooling the ceramic laminate from the second temperature to the first temperature while the ceramic laminate is compressed;
and
depressurizing the ceramic laminate to reduce pressure on the ceramic laminate from the second pressure to the first pressure.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/847,549Filed 23 Jun 2022

Priority

KR 10-2021-013481812 Oct 2021

Published

US 2023/0114992 A113 Apr 2023

Granted

15 Apr 2025

Term ends

Not estimatedThe source records don’t support an estimate.

Classification29 codes

B32B 37/10
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by the pressing technique, e.g. using action of vacuum…
B32B 18/00
Layered products essentially comprising ceramics
B32B 37/06
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by the heating method
B32B 37/08
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by the cooling method

Method for compressing laminate and method for manufacturing ceramic electronic component including laminate

Life of this patent

Method for compressing laminate and method for manufacturing ceramic electronic component including laminate

Life of this patent

Abstract

Claims17