Laser cutting systems and methods

A method for cutting a component comprising:

• charging the component from a charging area to a first laser station, the first laser station comprising a first fixture, and a first plurality of multi-axis robots including first laser cutting heads, and wherein the first plurality of multi-axis robots are arranged on opposite sides of the first fixture;
• cutting a first plurality of areas of the component simultaneously with the first laser cutting heads of the first plurality of multi-axis robots while the component is held in the first fixture;
• followed by
• transporting the component from the first fixture of the first laser station to a second fixture of a second laser station using a gripper mounted on a multi-axis robot for gripping the component, the second laser station comprising the second fixture, and the second fixture being different from the first fixture, and a second plurality of multi-axis robots including second laser cutting heads different from the first laser cutting heads and the first plurality of multi-axis robots, and wherein the second plurality of multi-axis robots are arranged on opposite sides of the second fixture;
• after transporting from the first fixture to the second fixture, the component from the first laser station to the second laser station, cutting a second plurality of areas of the component simultaneously with the second laser cutting heads of the second plurality of multi-axis robots while the component is positioned on the second fixture;
• and
• discharging the component from the second laser station to a discharging area.