Leadframe, bracket and LED device

A leadframe, comprising:

• a first photo-etched metal part, composed of a first electrode and a chip placement layer stacked thereon, wherein the chip placement layer comprises a first placement zone and a second placement zone connected to each other;
• wherein the first placement zone has a greater length than that of the second placement zone;
• wherein a first end of the first placement zone is flush with a first end of the second placement zone so as to together become a first long edge of the chip placement layer;
• and wherein a second end of the first placement zone and a second end of the second placement zone together become a second edge of the chip placement layer;
• and wherein the chip placement layer has a greater length for long edges and a greater length for short edges than those of the first electrode;
• and
• a second photo-etched metal part, composed of a second electrode and a connection layer stacked thereon, wherein the connection layer has a greater length for long edges and a greater length for short edges than those of the second electrode;
• wherein the first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode, so that a first isolation trench is formed between the first electrode and the second electrode, and a second isolation trench is formed between the chip placement layer and the connection layer;
• and
• wherein the chip placement layer and the connection layer are respectively provided with L-shaped pins at corners of their respective first long edges to cover sidewalls of the corresponding corners.