Systems for cooler devices and cooling manifolds
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., Alliance for Sustainable Energy, LLC, The Regents of the University of California, Merced, The Board of Trustees of the Leland Stanford Junior University, United States Department of Energy
InventorsSougata Hazra, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Ercan M. Dede, James Palko, Sreekant Narumanchi
Life of this patent
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Abstract
Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.
Claims17
A cooler device comprising:
- a manifold constructed at least partially of silicon, comprising:
- an array of inlet channels, each inlet channel having a first depth;
- an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth, each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels;
- a manifold case configured to be in contact with a cold plate and encapsulate the manifold, the array of inlet channels, and the array of outlet channels, the manifold case comprising:
- a fluid inlet;
- a fluid outlet, wherein the fluid inlet is for receiving coolant into the manifold, and the fluid outlet is for removing the liquid coolant from the;
- and
- at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold.
A cooler device comprising:
- a cold plate;
- a manifold constructed at least partially of silicon, comprising:
- an array of inlet channels, each inlet channel having a first depth;
- and
- an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth;
- each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels;
- and
- a manifold case configured to be in contact with the cold plate and encapsulate the manifold, the array of inlet channels, and the array of outlet channels, the manifold case comprising:
- a fluid inlet;
- a fluid outlet, wherein the fluid inlet is for receiving coolant into the manifold, and the fluid outlet is for removing the liquid coolant from the manifold;
- and
- at least one vapor outlet, wherein the at least one vapor outlet is for removing a vapor from the manifold.
A cooler device comprising:
- a manifold constructed at least partially of silicon, comprising:
- an array of inlet channels, each inlet channel having a first depth;
- and
- an array of outlet channels interlaced with the array of inlet channels, each outlet channel having a second depth that is larger than the first depth, each of the array of outlet channels having a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels, wherein:
- each inlet channel comprises a plurality of spacer elements disposed along a length of each inlet channel;
- and
- each spacer element of the plurality of spacer elements defines a jetted nozzle profile and is configured to distribute coolant by fluid capillary wicking action along the length of each inlet channel.
Dependencies are inferred from the claim text.