Holding device and method of manufacturing holding device

A method of manufacturing a holding device which comprises a ceramic member having a first surface and formed of a sintered ceramic material containing aluminum nitride as a main component, a heating resistor element formed of a metal and disposed in the ceramic member, an electrically conductive electricity supply connection member which is entirely embedded inside the ceramic member and is in contact with the heating resistor element, and an electrically conductive electricity supply terminal which is electrically connected to the electricity supply connection member and extends outside of the ceramic member, and which holds an object on the first surface of the ceramic member,

• the method being characterized by comprising the steps of:
• forming a second coat layer which is a nitride selected from the group consisting of AlN, AlTiN, AlTiSiN, AlZrN, AlTiCrN, VN, and NbN on at least a portion of a surface of the electricity supply connection member, excluding a contact surface of the electricity supply connection member for contact with the heating resistor element and a connection surface of the electricity supply connection member for connection with the electricity supply terminal;
• and
• forming, through firing, the ceramic member in which the heating resistor element and the electricity supply connection member having the coat layer formed thereon are disposed,
• wherein the electricity supply connection member is in the form of a plate having a circular shape,
• the electricity supply terminal is in the form of a column having a circular shape,
• wherein the method further comprises forming a first coat layer which is a nitride containing at least one selected from the group consisting of Ti, Zr, V, Cr, Ta, and Nb on at least a portion of the contact surface of the electricity supply connection member for contact with the heating resistor element, and
• wherein the first coat layer has a thickness of 0.3 μm to 60 μm.