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US 12,272,922 B2Granted
Electronic chip support device and corresponding manufacturing method
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsFabien Quercia, Jean-Michel Riviere
Life of this patent
Estimating the term…
Abstract
Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.
Claims20
An electronic device, comprising:
- a support substrate having a first face;
- an electronic chip having a second face coupled to the first face of the support substrate by an adhesive;
- and
- a plurality of arcuate wire bonds projecting from the first face of the support substrate, the second face of the electronic chip on contact areas of the plurality of arcuate wire bonds, the adhesive being between the plurality of arcuate wire bonds, each one of the plurality of arcuate wire bonds including:
- a first end and a second end coupled to the first face of the support substrate;
- and
- an extremum between the first end and the second end, the extremum contacting the second face of the electronic chip at the contact areas, the contact areas being exposed from the adhesive.
4 more elements
A method for manufacturing an electronic device, comprising:
- forming a plurality of arcuate wire bonds on a first face of a substrate projecting from the first face of the substrate, each arcuate wire bond of the plurality of arcuate wire bonds has an extremum between a first end and a second end;
- forming an adhesive on the first face of the substrate spaced from the plurality of arcuate wire bonds, forming the adhesive including:
- forming a first portion extending in a first direction between first ones of the plurality of arcuate wire bonds;
- and
- forming a second portion extending in a second direction at an angle relative to the first portion between second ones of the plurality of arcuate wire bonds;
- and
- mounting an electronic chip on contact areas of the plurality of arcuate wire bonds by bonding a second face of the electronic chip to the first face of the substrate by the adhesive, the extremum contacting the second face of the electronic chip at the contact areas, the contact areas being exposed from the adhesive.
4 more elements
A method of manufacturing an electronic device, comprising:
- forming a plurality of wedging elements on a first face of a substrate projecting from the first face of the substrate, forming the plurality of wedging elements further includes:
- forming the plurality of wedging elements from at least one of the following of a resin of a solder mask or a metal material;
- forming an adhesive on the first face of the substrate spaced apart from the plurality of wedging elements, forming the adhesive including:
- forming a first portion extending in a first direction between ones of the plurality of wedging elements;
- and
- forming a second portion extending in a second direction at an angle relative to the first portion between second ones of the plurality of wedging elements;
- and
- mounting an electronic chip on contact areas of the wedging elements by bonding a second face of the electronic chip to the first face of the substrate by the adhesive, the mounting the electronic chip to the contact areas of the wedging element includes spreading the adhesive out to extend outward from the plurality of wedging elements and cover the plurality of wedging element in the adhesive.
5 more elements
Dependencies are inferred from the claim text.