Substrate polishing apparatus

A substrate polishing apparatus, comprising:

• a stage having a flat surface, which is parallel to a first direction and a second direction, and configured to support a substrate;
• a pressing unit configured to exert a pressure on the substrate in a third direction perpendicular to the first and second directions at a position overlapping the stage;
• a rotary unit connected to the pressing unit, the rotary unit being configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view;
• a plurality of polishing pads provided between the pressing unit and the substrate and used to polish the substrate;
• and
• a nozzle part configured to supply a slurry onto the substrate,
• wherein:
• the polishing pads are spaced apart from each other in a direction parallel to a motion of the substrate;
• when measured in the second direction, a length of each of the polishing pads is greater than a length of the substrate;
• each of the polishing pads has a rectangular shape in a plan view;
• the rotary unit comprises a body part and a rotary part that executes a circular motion about the central axis with respect to the body part;
• the rotary part includes a rectangular portion that is longer in the second direction than the first direction;
• the body part defines a ring-shaped groove on a surface thereof facing the third direction;
• and
• wherein the rotary part includes a circular portion coupled to the body part so as to be movable within the ring-shaped groove.